{ "items" : [
    { "id" : "http://dbpedia.org/resource/Wafer-level_packaging"
      "properties" : {
        "http://www.w3.org/2000/01/rdf-schema#comment" : [ "Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die."] } } }
